Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Detalhes bibliográficos
Outros Autores: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Formato: Livro
Idioma:English
Publicado em: Park Ridge, N.J. Noyes c1993.
Assuntos:
Integrated circuits > Design and construction.
Metallizing.