Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Détails bibliographiques
Autres auteurs: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Format: Livre
Langue:English
Publié: Park Ridge, N.J. Noyes c1993.
Sujets:
Integrated circuits > Design and construction.
Metallizing.