Physical design for multichip modules

Detalhes bibliográficos
Autor principal:	Sriram, M. (Mysore) 1966-
Outros Autores:	Kang, Sung-Mo 1945-
Formato:	Livro
Idioma:	English
Publicado em:	Boston Kluwer Academic Pub. c1994.
Colecção:	The Kluwer international series in engineering and computer science SECS 267
Assuntos:	Electronic packaging > Design. Multichip modules (Microelectronics) > Design and construction.