Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

書誌詳細
その他の著者: Pecht, Michael
フォーマット: 図書
言語:English
出版事項: New York Wiley c1994.
主題:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.