Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

ग्रंथसूची विवरण
अन्य लेखक: Pecht, Michael
स्वरूप: पुस्तक
भाषा:English
प्रकाशित: New York Wiley c1994.
विषय:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.