Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Sonraí bibleagrafaíochta
Rannpháirtithe: Pecht, Michael
Formáid: LEABHAR
Teanga:English
Foilsithe / Cruthaithe: New York Wiley c1994.
Ábhair:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.