Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Xehetasun bibliografikoak
Beste egile batzuk: Pecht, Michael
Formatua: Liburua
Hizkuntza:English
Argitaratua: New York Wiley c1994.
Gaiak:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.