Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Podrobná bibliografie
Další autoři: Pecht, Michael
Médium: Kniha
Jazyk:English
Vydáno: New York Wiley c1994.
Témata:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.