Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Bibliografiset tiedot
Muut tekijät: Pecht, Michael
Aineistotyyppi: Kirja
Kieli:English
Julkaistu: New York Wiley c1994.
Aiheet:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.