Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Bibliografske podrobnosti
Drugi avtorji: Pecht, Michael
Format: Knjiga
Jezik:English
Izdano: New York Wiley c1994.
Teme:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.