Quality conformance and qualification of microelectronic packages and interconnects

Bibliographische Detailangaben
Weitere Verfasser:	Pecht, Michael
Format:	Buch
Sprache:	English
Veröffentlicht:	New York Wiley c1994.
Schlagworte:	Electronic packaging > Defects. Electronic packaging > Quality control. Electronic packaging > Testing. Quality assurance.