Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Dades bibliogràfiques
Altres autors: Pecht, Michael
Format: Llibre
Idioma:English
Publicat: New York Wiley c1994.
Matèries:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.