Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Detalhes bibliográficos
Outros Autores: Pecht, Michael
Formato: Livro
Idioma:English
Publicado em: New York Wiley c1994.
Assuntos:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.