Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Manylion Llyfryddiaeth
Awduron Eraill: Pecht, Michael
Fformat: Llyfr
Iaith:English
Cyhoeddwyd: New York Wiley c1994.
Pynciau:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.