Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

書目詳細資料
主要作者: Pecht, Michael
格式: 圖書
語言:English
出版: New York Wiley c1994.
主題:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.