Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Bibliografski detalji
Glavni autor: Pecht, Michael
Format: Knjiga
Jezik:English
Izdano: New York Wiley c1994.
Teme:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.