Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

מידע ביבליוגרפי
מחבר ראשי: Pecht, Michael
פורמט: ספר
שפה:English
יצא לאור: New York Wiley c1994.
נושאים:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.