Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Detalles Bibliográficos
Autor Principal: Pecht, Michael
Formato: Libro
Idioma:English
Publicado: New York Wiley c1994.
Subjects:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.