Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Xehetasun bibliografikoak
Egile nagusia: Pecht, Michael
Formatua: Liburua
Hizkuntza:English
Argitaratua: New York Wiley c1994.
Gaiak:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.