Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Manylion Llyfryddiaeth
Prif Awdur: Pecht, Michael
Fformat: Llyfr
Iaith:English
Cyhoeddwyd: New York Wiley c1994.
Pynciau:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.