Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Dades bibliogràfiques
Autor principal: Pecht, Michael
Format: Llibre
Idioma:English
Publicat: New York Wiley c1994.
Matèries:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.