Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

التفاصيل البيبلوغرافية
المؤلف الرئيسي: Pecht, Michael
التنسيق: كتاب
اللغة:English
منشور في: New York Wiley c1994.
الموضوعات:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.