Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Bibliographische Detailangaben
1. Verfasser: Pecht, Michael
Format: Buch
Sprache:English
Veröffentlicht: New York Wiley c1994.
Schlagworte:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.