Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Bibliografiska uppgifter
Huvudupphovsman: Pecht, Michael
Materialtyp: Bok
Språk:English
Publicerad: New York Wiley c1994.
Ämnen:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.