Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Detaylı Bibliyografya
Yazar: Pecht, Michael
Materyal Türü: Kitap
Dil:English
Baskı/Yayın Bilgisi: New York Wiley c1994.
Konular:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.