Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Sonraí bibleagrafaíochta
Príomhchruthaitheoir: Pecht, Michael
Formáid: LEABHAR
Teanga:English
Foilsithe / Cruthaithe: New York Wiley c1994.
Ábhair:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.