Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Dettagli Bibliografici
Autore principale: Pecht, Michael
Natura: Libro
Lingua:English
Pubblicazione: New York Wiley c1994.
Soggetti:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.