Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Bibliografische gegevens
Hoofdauteur: Pecht, Michael
Formaat: Boek
Taal:English
Gepubliceerd in: New York Wiley c1994.
Onderwerpen:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.