Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Opis bibliograficzny
1. autor: Lau, John H.
Kolejni autorzy: Lee, Shi-Wei Ricky
Format: Książka
Język:English
Wydane: New York McGraw-Hill c1999.
Hasła przedmiotowe:
Integrated circuits > Design and construction.
Microelectronic packaging.