Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

书目详细资料
主要作者: Lau, John H.
其他作者: Lee, Shi-Wei Ricky
格式: 图书
语言:English
出版: New York McGraw-Hill c1999.
主题:
Integrated circuits > Design and construction.
Microelectronic packaging.