Chip scale package (CSP) design, materials, processes, reliability, and applications

Ngā taipitopito rārangi puna kōrero
Kaituhi matua:	Lau, John H.
Ētahi atu kaituhi:	Lee, Shi-Wei Ricky
Hōputu:	Pukapuka
Reo:	Ingarihi
I whakaputaina:	New York McGraw-Hill c1999.
Ngā marau:	Integrated circuits > Design and construction. Microelectronic packaging.