Chip scale package (CSP) design, materials, processes, reliability, and applications

Detalles Bibliográficos
Autor Principal:	Lau, John H.
Outros autores:	Lee, Shi-Wei Ricky
Formato:	Libro
Idioma:	English
Publicado:	New York McGraw-Hill c1999.
Subjects:	Integrated circuits > Design and construction. Microelectronic packaging.