Chip scale package (CSP) design, materials, processes, reliability, and applications
| Príomhchruthaitheoir: | |
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| Rannpháirtithe: | |
| Formáid: | LEABHAR |
| Teanga: | English |
| Foilsithe / Cruthaithe: |
New York
McGraw-Hill
c1999.
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| Ábhair: |