Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Dades bibliogràfiques
Autor principal: Lau, John H.
Altres autors: Lee, Shi-Wei Ricky
Format: Llibre
Idioma:English
Publicat: New York McGraw-Hill c1999.
Matèries:
Integrated circuits > Design and construction.
Microelectronic packaging.