Okładka

Routing in the third dimension from VLSI chips to MCMs

Opis bibliograficzny
1. autor: Sherwani, Naveed A.
Kolejni autorzy: Bhingarde, Siddharth, Panyam, Anand
Format: Książka
Język:angielski
Wydane: Piscataway, N.J. IEEE Press c1995.
Hasła przedmiotowe:
Integrated circuits > Very large scale integration > Design and construction > Data processing.
Computer-aided design.
Multichip modules (Microelectronics) > Design and construction > Data processing.