Routing in the third dimension from VLSI chips to MCMs

Routing in the third dimension from VLSI chips to MCMs

Detalhes bibliográficos
Autor principal: Sherwani, Naveed A.
Outros Autores: Bhingarde, Siddharth, Panyam, Anand
Formato: Livro
Idioma:English
Publicado em: Piscataway, N.J. IEEE Press c1995.
Assuntos:
Integrated circuits > Very large scale integration > Design and construction > Data processing.
Computer-aided design.
Multichip modules (Microelectronics) > Design and construction > Data processing.