Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

书目详细资料
其他作者:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
格式:	图书
语言:	English
出版:	New York Wiley c1995.
主题:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.