Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Bibliografske podrobnosti
Drugi avtorji: Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Format: Knjiga
Jezik:English
Izdano: New York Wiley c1995.
Teme:
Microelectronic packaging > Materials.
Microencapsulation.
Plastics in packaging.