Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Bibliografski detalji
Daljnji autori:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Format:	Knjiga
Jezik:	English
Izdano:	New York Wiley c1995.
Teme:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.