Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Bibliografiske detaljer
Andre forfattere:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Format:	Bog
Sprog:	English
Udgivet:	New York Wiley c1995.
Fag:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.