Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Manylion Llyfryddiaeth
Awduron Eraill:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Fformat:	Llyfr
Iaith:	English
Cyhoeddwyd:	New York Wiley c1995.
Pynciau:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.