Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Podrobná bibliografie
Další autoři:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Médium:	Kniha
Jazyk:	English
Vydáno:	New York Wiley c1995.
Témata:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.