Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Opis bibliograficzny
Kolejni autorzy: Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Format: Książka
Język:English
Wydane: New York Wiley c1995.
Hasła przedmiotowe:
Microelectronic packaging > Materials.
Microencapsulation.
Plastics in packaging.