Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Detalles Bibliográficos
Outros autores:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Formato:	Libro
Idioma:	English
Publicado:	New York Wiley c1995.
Subjects:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.