Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Detaylı Bibliyografya
Diğer Yazarlar:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Materyal Türü:	Kitap
Dil:	English
Baskı/Yayın Bilgisi:	New York Wiley c1995.
Konular:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.