Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Détails bibliographiques
Autres auteurs:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Format:	Livre
Langue:	English
Publié:	New York Wiley c1995.
Sujets:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.