Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Bibliographic Details
Other Authors: Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Format: Book
Language:English
Published: New York Wiley c1995.
Subjects:
Microelectronic packaging > Materials.
Microencapsulation.
Plastics in packaging.