Microelectronic system interconnections performance and modeling

Microelectronic system interconnections performance and modeling

Detalhes bibliográficos
Outros Autores: Tewksbury, Stuart K.
Formato: Livro
Idioma:English
Publicado em: New York IEEE Press c1994.
Assuntos:
Microelectronic packaging > Mathematical models.
Multichip modules (Microelectronics) > Mathematical models.
Optical fibers > Joints > Mathematical models.