Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Podrobná bibliografie
Korporativní autor: IEEE Components, Hybrids, and Manufacturing Technology Society
Další autoři: Morris, James E. 1944-
Médium: Kniha
Jazyk:English
Vydáno: New York The Institute of Electrical and Electronics Engineers c1994.
Témata:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.