Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Bibliographische Detailangaben
Körperschaft: IEEE Components, Hybrids, and Manufacturing Technology Society
Weitere Verfasser: Morris, James E. 1944-
Format: Buch
Sprache:English
Veröffentlicht: New York The Institute of Electrical and Electronics Engineers c1994.
Schlagworte:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.