Electronics packaging forum multichip module technology issues

Библиографические подробности
Соавтор:	IEEE Components, Hybrids, and Manufacturing Technology Society
Другие авторы:	Morris, James E. 1944-
Формат:	‌
Язык:	English
Опубликовано:	New York The Institute of Electrical and Electronics Engineers c1994.
Предметы:	Electronic packaging > Design. Multichip modules (Microelectronics) > Design and construction.