Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Detaylı Bibliyografya
Müşterek Yazar: IEEE Components, Hybrids, and Manufacturing Technology Society
Diğer Yazarlar: Morris, James E. 1944-
Materyal Türü: Kitap
Dil:English
Baskı/Yayın Bilgisi: New York The Institute of Electrical and Electronics Engineers c1994.
Konular:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.