Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Manylion Llyfryddiaeth
Awdur Corfforaethol: IEEE Components, Hybrids, and Manufacturing Technology Society
Awduron Eraill: Morris, James E. 1944-
Fformat: Llyfr
Iaith:English
Cyhoeddwyd: New York The Institute of Electrical and Electronics Engineers c1994.
Pynciau:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.