Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Bibliographic Details
Corporate Author: IEEE Components, Hybrids, and Manufacturing Technology Society
Other Authors: Morris, James E. 1944-
Format: Book
Language:English
Published: New York The Institute of Electrical and Electronics Engineers c1994.
Subjects:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.