Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

書誌詳細
団体著者: IEEE Components, Hybrids, and Manufacturing Technology Society
その他の著者: Morris, James E. 1944-
フォーマット: 図書
言語:English
出版事項: New York The Institute of Electrical and Electronics Engineers c1994.
主題:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.