Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Dettagli Bibliografici
Ente Autore: IEEE Components, Hybrids, and Manufacturing Technology Society
Altri autori: Morris, James E. 1944-
Natura: Libro
Lingua:English
Pubblicazione: New York The Institute of Electrical and Electronics Engineers c1994.
Soggetti:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.