Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Bibliografiska uppgifter
Institutionell upphovsman: IEEE Components, Hybrids, and Manufacturing Technology Society
Övriga upphovsmän: Morris, James E. 1944-
Materialtyp: Bok
Språk:English
Publicerad: New York The Institute of Electrical and Electronics Engineers c1994.
Ämnen:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.