Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Bibliografiske detaljer
Institution som forfatter: IEEE Components, Hybrids, and Manufacturing Technology Society
Andre forfattere: Morris, James E. 1944-
Format: Bog
Sprog:English
Udgivet: New York The Institute of Electrical and Electronics Engineers c1994.
Fag:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.