Electronics packaging forum multichip module technology issues

Electronics packaging forum multichip module technology issues

Opis bibliograficzny
Korporacja: IEEE Components, Hybrids, and Manufacturing Technology Society
Kolejni autorzy: Morris, James E. 1944-
Format: Książka
Język:English
Wydane: New York The Institute of Electrical and Electronics Engineers c1994.
Hasła przedmiotowe:
Electronic packaging > Design.
Multichip modules (Microelectronics) > Design and construction.