Electronics packaging forum multichip module technology issues

Detalles Bibliográficos
Autor Corporativo:	IEEE Components, Hybrids, and Manufacturing Technology Society
Outros autores:	Morris, James E. 1944-
Formato:	Libro
Idioma:	English
Publicado:	New York The Institute of Electrical and Electronics Engineers c1994.
Subjects:	Electronic packaging > Design. Multichip modules (Microelectronics) > Design and construction.