IEEE Components, Hybrids, and Manufacturing Technology Society, & Morris, J. E. (1994). Electronics packaging forum: Multichip module technology issues. The Institute of Electrical and Electronics Engineers.
Citação do estilo Chicago (17ª ed.)IEEE Components, Hybrids, and Manufacturing Technology Society, e James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. New York: The Institute of Electrical and Electronics Engineers, 1994.
Citação MLA (9ª ed.)IEEE Components, Hybrids, and Manufacturing Technology Society, e James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. The Institute of Electrical and Electronics Engineers, 1994.
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