APA (7th ed.) Citation

IEEE Components, Hybrids, and Manufacturing Technology Society, & Morris, J. E. (1994). Electronics packaging forum: Multichip module technology issues. The Institute of Electrical and Electronics Engineers.

Chicago Style (17th ed.) Citation

IEEE Components, Hybrids, and Manufacturing Technology Society, and James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. New York: The Institute of Electrical and Electronics Engineers, 1994.

MLA (9th ed.) Citation

IEEE Components, Hybrids, and Manufacturing Technology Society, and James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. The Institute of Electrical and Electronics Engineers, 1994.