Cita APA (7a ed.)

IEEE Components, Hybrids, and Manufacturing Technology Society, & Morris, J. E. (1994). Electronics packaging forum: Multichip module technology issues. The Institute of Electrical and Electronics Engineers.

Cita Chicago Style (17a ed.)

IEEE Components, Hybrids, and Manufacturing Technology Society, y James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. New York: The Institute of Electrical and Electronics Engineers, 1994.

Cita MLA (9a ed.)

IEEE Components, Hybrids, and Manufacturing Technology Society, y James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. The Institute of Electrical and Electronics Engineers, 1994.