IEEE Components, Hybrids, and Manufacturing Technology Society, & Morris, J. E. (1994). Electronics packaging forum: Multichip module technology issues. The Institute of Electrical and Electronics Engineers.
Citace podle Chicago (17th ed.)IEEE Components, Hybrids, and Manufacturing Technology Society, a James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. New York: The Institute of Electrical and Electronics Engineers, 1994.
Citace podle MLA (9th ed.)IEEE Components, Hybrids, and Manufacturing Technology Society, a James E. Morris. Electronics Packaging Forum: Multichip Module Technology Issues. The Institute of Electrical and Electronics Engineers, 1994.
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